Mr. Semiconductor · Supply-Chain ResearchIC Substrates Industry Outlook
IC Substrates · Updated: Sep 14, 2026 08:53
Segment overview
High-density interconnect substrates linking die, package and PCB.
Key investment drivers
- Larger AI packages and more substrate layers
- ABF substrate inventory normalization
- Yield improvement in premium substrates
Representative public companies
- Unimicron (3037.TW)
- Nan Ya PCB (8046.TW)
- Ibiden (4062.T)
Industry activity
71 / 100
Stronger industry activity
Market expectations
89 / 100
Stronger market expectation
Recent change
7-day -3 · 1-day -1
Latest verified research signals
Over the past three days, no material new developments have emerged for the package substrate node from company announcements, regulatory filings, orders, capacity or pricing adjustments. Only broad Asian and Japanese equity market declines
Supply-chain position
Upstream: —
Downstream: Advanced Packaging & Heterogeneous Integration
Mr. Semi publishes this research from public market and supply-chain data, with AI-assisted classification and summarization. For research purposes only; not investment advice.