A practical guide to the semiconductor supply chain — chip design, manufacturing, memory, packaging, equipment and materials — with key companies and how to research them.
The semiconductor supply chain is the series of industries that turn raw silicon and chemicals into finished chips — from chip design and EDA/IP, through wafer manufacturing and memory production, to packaging, testing, and the equipment and materials used along the way. Because each stage depends on the stage before it, supply, pricing and demand signals transmit from one end of the chain to the other.
Design houses and chip architects define what gets built — from AI accelerators, GPUs and CPUs to analog, RF and automotive compute silicon.
Representative companies: Synopsys · Cadence Design Systems · Arm · NVIDIA · Broadcom · Alphabet
Memory makers produce the DRAM, NAND and high-bandwidth memory (HBM) that feed AI, server and device demand.
Representative companies: SK 海力士 · Micron · 三星电子
Foundries turn designs into wafers — advanced logic, mature and specialty nodes, memory fabs and compound semiconductors.
Representative companies: 台积电 · GlobalFoundries · SMIC · SK 海力士 · Micron · 三星电子
Back-end steps assemble, stack and test chips. Advanced packaging and heterogeneous integration are critical for AI accelerators.
Representative companies: 台积电 · Amkor · ASE Technology · Teradyne · Advantest · FormFactor
Lithography, etch, deposition, metrology and test tools determine what can be manufactured at scale.
Representative companies: Nikon · Canon · Lam Research · Applied Materials · ASM International · KLA
Wafers, photoresist, photomasks, electronic gases, chemicals and substrates feed the fabs and packaging lines.
Representative companies: SUMCO · Shin-Etsu Chemical · GlobalWafers · Soitec · Tokyo Ohka Kogyo · HOYA
Semiconductor demand flows from these end markets. Each one is tracked as its own research chain on this site:
The semiconductor supply chain is the sequence of industries that turn raw materials into finished chips: chip design, EDA and IP, wafer manufacturing and foundries, memory production, packaging and testing, plus the equipment and materials that make fabrication possible. It ends with demand from AI data centers, automotive, industrial, consumer electronics and other end markets.
The main stages are chip design, EDA and IP licensing, manufacturing (foundries), memory, packaging and testing, semiconductor equipment, and materials and substrates. Each stage depends on the others, so supply and demand signals transmit along the chain.
Representative companies include NVIDIA and AMD in design, TSMC in foundry, SK Hynix, Samsung and Micron in memory, ASML, Applied Materials and Lam Research in equipment, and Shin-Etsu, SUMCO and other suppliers in materials. Packaging and OSAT leaders include ASE, Amkor and others.
AI accelerators and data-center demand, advanced packaging for high-bandwidth memory, new nodes and chiplet architectures, plus demand from automotive, industrial, telecom and edge AI are the main drivers. Trade and export-control policy also shape where manufacturing and supply concentrate.